華中科技大學機械科學與工程學院始建于1952年，是華中科技大學規模最大、實力最雄厚的學院之一，擁有中國科學院/工程院院士8人，機械工程一級學科在全國學科評估中連續獲評A+，智能制造裝備與技術全國重點實驗室被連續評估為優秀類國家重點實驗室。依托華中科技大學機械科學與工程學院全國重點實驗室和相關的科研平臺劉長清教授課題組擬向國內外公開招聘博士后科研人員2-3名。

一、課題組負責人介紹

現任華中科技大學機械科學與工程學院教授、博士生導師劉長清長期從事先進電子材料和制造技術的創新研究，包括半導體芯片器件異構集成，互連，封裝及可靠性、互連界面特性及鍵合機理、電化學沉積互連凸點、功率電子及寬帶半導體集成與封裝、生物電子和智能可穿戴電子等相關的研究工作。迄今為止在相關領域國際材料及先進制造期刊及國際會議發表了300多篇相關學術論文。主持參與了若干科研項目并與世界各地包括帝國理工、倫敦大學國王學院、諾丁漢大學、曼徹斯特大學、新加坡南洋理工大學、香港城市大學等約30所院校、研究機構合作交流，指導了近40名博士生。他是美國電器電子工程師協會（IEEE）資深會員、曾任IEEE協會電子封裝(EPS) 領域旗艦電子元件和技術國際會議（ECTC）的電子互連委員會主席，先后受聘于新加坡南洋理工大學、和香港城市大學(由英國皇家協會資助和任命)等國際知名大學的客座教授。

二、研究方向與內容

半導體元器件異構集成及制造技術：電子封裝材料及制備；銅互連及其應用；電子互連界面特性、力學行為與可靠性； “綠色”可持續電子制造。

嚴酷服役條件下的電子互連材料及制造技術：高溫互連材料，制造及應用；低溫電子互連材料和制備；嚴酷環境下熱-電-機械耦合可靠性分析及失效機理。

寬帶半導體集成互連和熱管理優化：功率電子寬帶半導體先進互連材料與制程優化 (die-attach, substrate-attach)；高溫擴散障、熱界面材料制備及系統熱管理優化。

生物及智能可穿戴電子異質集成技術：生物電子界面材料和制備；打印/柔性/有機電子相關材料及制造技術；電-生物-多材料多功能系統集成； 3D增材構建多功能復合仿生組織。

三、應聘條件

1.申請者年齡不超過35周歲，獲得博士學位不超過3年，具有嚴謹的科研態度和良好的團隊協作精神，符合華中科技大學博士后招聘條件http://postdoctor.hust.edu.cn/info/1007/2928.htm。

2.應聘者應具有與以上相關研究方向學科背景，包括先進電子材料與制造技術，集成電路及電子器件互連與封裝，機械電子技術，電子信息工程等多學科交叉領域。具有較強的理論基礎、實踐能力、獨立的科研能力，以及良好的團隊合作精神。

3.具有較強的英語交流與寫作能力，并能夠積極參與實驗室建設和研究生培養工作。

四、崗位待遇

1.博士后聘用期限為2年起，年薪40-60萬，并享受各類成果獎勵。

2.博士后在聘期內，參照學校在編在崗職工，享受子女入學入托、社會醫療保險以及其他社會保險等福利待遇；可申請入住博士后公寓；表現優秀者可競聘教師崗位。

3.提供充足的科研經費和完善的實驗條件，提供國際會議等交流機會，協助申報科研項目。

五、應聘材料及申請流程

1.個人中英文簡歷（包括個人基本信息、學習工作經歷、科研項目參與情況、博士論文研究內容、論文發表情況等）

2.證明材料（博士學位證書掃描件或教育部學籍在線驗證報告、學位論文首頁以及不超過5篇代表作）

3.兩封以上本學科領域高級職稱專家推薦信。

4.博士后工作期間研究計劃和預期目標。  

5.應聘者應將上述材料按順序合并成1個PDF文件，發送到chenjia617@hust.edu.cn，郵件標題請注明：應聘博士后+本人姓名。

6.截止時間: 長年有效。

Postdoctoral Research Positions

Advanced Electronics Materials and Manufacturing

School of Mechanical Science and Engineering

Huazhong University of Science and Technology

Founded in 1952, the School of Mechanical Science and Engineering is one of the largest and strongest colleges in Huazhong University of Science and Technology(HUST), with 8 academicians of the Chinese Academy of Sciences/Academy of Engineering. Based on the National Key Laboratory at the School of Mechanical Science and Engineering of HUST and related scientific research platforms, Professor Liu Changqing's research group seeks to recruit 2-3 postdoctoral researchers in the areas of advanced electronics materials and manufacturing technology.

1. Professor Liu Changqing

   Prof. Liu is a professor and doctoral supervisor at the School of Mechanical Science and Engineering at HUST in China, and an emeritus professor of Loughborough University in the United Kingdom. He has been extensively engaged in innovative research on advanced electronic materials and manufacturing technologies, including IC device heterogeneous integration, interconnection, packaging, interfacial characteristics and bonding mechanisms and reliability analysis; power electronics and Wide-band Gap (WBG) semiconductor integration and packaging; bioelectronics and intelligent wearable and implantable electronics. He has published more than 300 academic articles in international journals and conferences, and collaborated with over 30 universities and research institutions around the world, including Imperial College London, King's College London, University of Nottingham, University of Manchester, Nanyang Technological University of Singapore, City University of Hong Kong, etc., and his research work have attracted an extensive attention and recognition from his international peers, relevant organisations and industries.

Liu Changqing-School of Mechanical Science and Engineering (hust.edu.cn)

1. Description of Research Areas

Heterogeneous integration and packaging of semiconductor devices: electronic packaging materials and preparation; copper interconnection and its application; interface characteristics, mechanical behavior and reliability of electronic interconnection; "green" sustainable electronics manufacturing.

Electronic interconnect materials and manufacturing in harsh environments: high-temperature interconnect materials, manufacturing and application; low-temperature electronic interconnect materials and preparation; reliability analysis and failure mechanism in thermal-electric-mechanical coupled harsh environments.

Wide-band Gap (WBG) semiconductor integration、interconnect and thermal management optimization: Advanced Interconnect Materials (AIMs) and processes for die-attach, substrate-attach and optimization in power electronics; high-temperature diffusion barriers, thermal interface material fabrication; and system thermal management optimization.

Heterogeneous integration for bioelectronics and intelligent wearable electronics: bioelectronic interface materials and fabrication; printing/flexible/organic electronics related materials and manufacturing technologies; bio-electronic multi-material multifunctional system integration; 3D additive construction of multifunctional composite bionic tissues.

1. Requirements and Qualifications of Applicants

2. Applicants should be ideally under the age of 35, have obtained a doctorate degree for no more than 3 years, bearing a rigorous scientific research attitude and good teamwork spirit, see the further details via http://postdoctor.hust.edu.cn/info/1007/2928.htm

3. Candidates should have a suitable PhD degree in the related science and engineering subjects such as physics and chemistry, materials, and some research experience in electronic materials and manufacturing, Integrated Circuit and device integration and packaging, with a strong theoretical foundation, relevant practical skills, independent scientific research ability, and good team spirit.

4. Competent English communication and writing skills, being able to actively participate in the activities for set-up of the laboratory and supply relevant training to graduate students.

1. Terms and Conditions

   1. The term of employment of postdoctoral fellows is 2 years, with an annual salary up to 400,000 Chinese Yuan.

   2. During the employment period, postdoctoral fellows can enjoy welfare benefits such as children's enrollment in nurseries, social medical insurance and other social insurance, and can apply for a place in postdoctoral apartments.

   3. The HUS will commit to the strongest supports to the successful candidates by providing sufficient research funds, an excellent research environment and development platform, offering opportunities of attending international conferences and other international research exchange, and helping for the research applications, and those with outstanding performance can be recommended for consideration of an offer of teaching position.

       

2. Procedures of Application

   1. Curriculum vitae in Chinese and English including basic personal information, academic work experience, participation in scientific research projects, research content of doctoral dissertation, publication of dissertation, etc.

   2. Supporting materials including scanned copy of doctoral degree certificate or online verification report of student status of the Ministry of Education, the first page of the dissertation and no more than 5 representative works).

   3. Two or more letters of recommendation from experts with senior professional titles in the relevant subject field.

   4. Research plan and expected goals during postdoctoral work.  

   5. Applicants should put together the above materials into single PDF file and send via email: chenjia617@hust.edu.cn with the subject indicated as “Postdoctoral application + Applicant’s name”.

   6. The dates and details of interview for shortlisted candidates will be arranged and notified separately.

   7. Deadline: Positions are open to outstanding candidates all the year around.

為防止簡歷投遞丟失請抄送一份至：boshijob@126.com（郵件標題格式：應聘職位名稱+姓名+學歷+專業+中國博士人才網）